Developed exclusively for SMT lines, this is a double-cleaning system of "rotating brush" + "rubber roll + adhesive tape" that is ideal for removing dust from the top surface of substrates.
It is possible to reliably collect foreign matter on the top surface of the substrate that could not be removed by the conventional brush-only method and adhesive roll-only method.
A reciprocating cleaning operation mode can also be selected.
By repeating cleaning multiple times, dust can be removed more reliably.
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